1 – Low Temperature Measurement Lab

Dilution refrigerator

Base temperature 20 mK, magnetic field up to 14 T, transport measurements in DC and RF mode.

HelioxVL – 3He refrigerator

Base temperature 300 mK, weak magnetic field, transport measurements in DC mode.

4K dipstick

Immersion stick for experiment in liquid helium (4.2 K) and liquid nitrogen (77 K), transport measurement in DC mode, heater for temperature control, weak magnetic field.

2 – D310 characterization Lab

In the D310 room we take advantage of two systems, belonging to the Quantum Device Physics Laboratory and to the Nanofabrication Laboratory, for the structural and transport characterization of our samples.

Panalytical X’Pert X-Ray Diffractometer

Four-circle diffractometer with various pre-aligned fast interchangeable x-ray optical modules. In the picture, the beam from the Cu X-ray tube (CuKα radiation) passes through a two-bounce Ge220 monochromator, which includes a mirror; the diffracted beam is detected by PIXcel 3D detector matrix.


The Quantum Design Physical Property Measurement System is used for transport measurements in DC and AC modes. Sample environment controls include magnetic fields up to ± 14 T and temperature range of 1.9 – 400 K.

3 – Nanofabrication Laboratory
(The Cleanroom)

The patterning of the quantum materials and the device fabrication entirely occur at the Nanofabrication Laboratory, a facility – managed by the Department of Microtechnology and Nanoscience at Chalmers – within Myfab, the Swedish Research Infrastructure for Micro and Nano Fabrication. Its core is a world-class university cleanroom for the fabrication of micro and nanotechnology. The nanofabrication laboratory has 193 tools available for fabrication and characterization at the micro/nano-scale.​ Among those, we focus in the following on those which are crucial for the research within the QManD group:

Pulsed Laser Deposition

UHV PLD system for the deposition of high quality YBCO thin films. Connected to a cluster of 3 deposition modules with a common transfer and loading system. Both loading of substrates and exchange of targets is possible at UHV.

Electron beam lithography

EBL – JEOL JBX 9300FS: High resolution electron beam lithography system. Acceleration voltage 100 kV, beam spotsize 4 nm – 100 nm.

Ion Beam Milling System – Oxford Ionfab 300 Plus

Ion Beam System for Argon ion milling with SIMS endpoint detection and with an automatic load-lock. An electron emitter ensures neutral ion beam space charge. The tool also has an alternative small sample specimen holder for LN2 cooling.

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